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The "ARDAI20"
Scaling
Accelerated

Ardent redefines modular data center scalability, offering rapid deployment, cost efficiency, and unmatched flexibility for AI, cloud, and HPC workloads.

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12

Move-in Ready

20+ MW

Per ARDAI20 DC

170

Per Rack IT load

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Built to scale

As a 20 MW blueprint, ARDAI20 provides seamless scalability, adapting to growing infrastructure needs with precision-engineered modularity.

With a
turn-key deployment timeline of under 12 months, businesses gain fully operational capacity faster than ever, ensuring maximum efficiency and future-proof expansion.

Designed for the latest high-density AI chips, including NVIDIA GB200 GPUs, which require 1,000 W per chip and above.

Flexible rack
& section configurations

Customize racks and sections to match
your compute, storage, or hybrid needs.

Scalable sections — Adapt layout, power,
and cooling as demands grow.

Optimized efficiency — Seamless integration for performance and sustainability.

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Concurrently
Maintainable

Energy Configuration

8 x 2.4 MW

Transformers

8 x EPG

Emergency Power Generators

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Scalable & sustainable


Pre-configured compute and storage – Optimized HPC, AI, and hybrid rack setups, supporting up to 170 kW per rack.

Advanced cooling and heat reuseDCLC and RDHX boost efficiency by 70%, enabling waste heat recovery for district heating and industrial use.

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High-density
AI compute

Built for the latest high-density AI chips, including NVIDIA GB200 GPUs, which require 1,000 W per chip and above. Our direct-to-chip liquid cooling system ensures optimal thermal performance, enabling maximum efficiency, sustained high-power computing, and seamless scalability for AI and HPC workloads.

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Direct-to-chip (DCLC)

Superior heat dissipation — Faster and more effective than air cooling.
Energy efficient — Reduces reliance on fans and air conditioning.
Optimized for high-density racks — Enables compact, high-performance server designs.

DCLC is no longer optional — it’s the only way forward for AI and HPC infrastructure

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Plus (RDHX)

The Legrand CL23 HPC Rear Door Cooler, combined with Direct-to-Chip Liquid Cooling, delivers unprecedented thermal efficiency for high-density AI and HPC workloads. This best-in-class combination removes heat directly at the source and at the rack level, ensuring peak performance, maximum energy savings, and up to 200 kW cooling per rack — a level never seen before in data center cooling.

Key value

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Energy efficiency & sustainability

Designed for ultra-low PUE (as low as 1.2), leveraging liquid cooling, renewable energy integration, and sustainable design.

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Rapid deployment & security

Prefabricated, modular design for fast deployment (in months, not years), reliability and advanced physical and cyber security.

Industries & use cases

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Al and high-performance computing (HPC)

Our modular data centers are engineered for Al and HPC applications, providing high-density, energy-efficient infrastructure to support advanced computing needs.

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Edge computing and loT deployments

We offer modular data centers enabling rapid deployment of edge computing solutions for real-time data processing in industrial environments.

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Rapid scalability and deployment

Our modular data centers allow for quick and efficient scalability, enabling customers to expand their data center capacity in response to evolving business requirements.

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Infrastructure
to full operation

With ARDAI20, we don’t just provide the data center infrastructure, we deliver a fully integrated, turn-key solution, including:

Server and network pre-installation — Full rack integration, cabling, and system setup before deployment.

Optimized configurations — AI, HPC, and storage pre-configured to your workload needs.

Seamless deployment — From power and cooling to networking and compute, ready for immediate operation.

Single-point responsibility — We handle the entire installation, testing, and commissioning process.

From facility to fully operational compute, ARDAI20 is a complete, hassle-free solution.