The "ARDAI20"
Scaling Accelerated

Ardent redefines modular data center scalability, offering rapid deployment, cost efficiency, and unmatched flexibility for AI, cloud, and HPC workloads.

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Built to scale

As a 20 MW blueprint, ARDAI20 provides seamless scalability, adapting to growing infrastructure needs with precision-engineered modularity.

With a turn-key deployment timeline of under 12 months, businesses gain fully operational capacity faster than ever, ensuring maximum efficiency and future-proof expansion.

Designed for the latest high-density AI chips, including NVIDIA GB200 GPUs, which require 1,000 W per chip and above.

Flexible rack
& section configurations

Customize racks and sections to match
your compute, storage, or hybrid needs.

Scalable sections — Adapt layout, power,
and cooling as demands grow.

Optimized efficiency — Seamless integration for performance and sustainability.

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High-density
AI compute

Built for the latest high-density AI chips, including NVIDIA GB200 GPUs, which require 1,000 W per chip and above. Our direct-to-chip liquid cooling system ensures optimal thermal performance, enabling maximum efficiency, sustained high-power computing, and seamless scalability for AI and HPC workloads.

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Direct-to-chip (DCLC)

Superior heat dissipation — Faster and more effective than air cooling.
Energy efficient — Reduces reliance on fans and air conditioning.
Optimized for high-density racks — Enables compact, high-performance server designs.

DCLC is no longer optional — it’s the only way forward for AI and HPC infrastructure

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Plus (RDHX)

The Legrand CL23 HPC Rear Door Cooler, combined with Direct-to-Chip Liquid Cooling, delivers unprecedented thermal efficiency for high-density AI and HPC workloads. This best-in-class combination removes heat directly at the source and at the rack level, ensuring peak performance, maximum energy savings, and up to 200 kW cooling per rack — a level never seen before in data center cooling.

Key value

Energy efficiency & sustainability

Designed for ultra-low PUE (as low as 1.2), leveraging liquid cooling, renewable energy integration, and sustainable design.

Rapid deployment & security

Prefabricated, modular design for fast deployment (in months, not years), reliability and advanced physical and cyber security.

Industries & use cases

Al and high-performance computing (HPC)

Our modular data centers are engineered for Al and HPC applications, providing high-density, energy-efficient infrastructure to support advanced computing needs.

Edge computing and loT deployments

We offer modular data centers enabling rapid deployment of edge computing solutions for real-time data processing in industrial environments.

Rapid scalability and deployment

Our modular data centers allow for quick and efficient scalability, enabling customers to expand their data center capacity in response to evolving business requirements.

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Infrastructure
to full operation

With ARDAI20, we don’t just provide the data center infrastructure, we deliver a fully integrated, turn-key solution, including:

Server and network pre-installation — Full rack integration, cabling, and system setup before deployment.

Optimized configurations — AI, HPC, and storage pre-configured to your workload needs.

Seamless deployment — From power and cooling to networking and compute, ready for immediate operation.

Single-point responsibility — We handle the entire installation, testing, and commissioning process.

From facility to fully operational compute, ARDAI20 is a complete, hassle-free solution.